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Deflection control of a large-scale silicon-wafer slicer cutting a crystal ingot

Transactions of the Japan Society of Mechanical Engineers. C Volume 60 Issue 570 Page 498-505
published_at 1994-02
2010010163.pdf
[fulltext] 434 KB
Title
シリコンウエハスライサのたわみ制御に関する研究
Deflection control of a large-scale silicon-wafer slicer cutting a crystal ingot
Creators Chonan Seiji
Creators Jiang Zhongwei
Creators Masui Keijiro
Creator Keywords
rotary machinery silicon-wafer slicer crystal ingot deflection control forces
Deformation control of a silicon-wafer slicer cutting a crystal ingot is studied analytically. The thin rotating blade is clamped at the outer boundary and prestressed in the radial direction, while the inner periphery is subjected to stationary, distributed in-plane and lateral slicing loads from the workpiece. The deflection of the blade is obtained analytically by introducing the multi-model expansion method, further applying the Galerkin method to the governing equations of the system. Numerical results are presented for an actual SUS 301 blade cutting a 6"-diameter silicon ingot at a speed of 1550 rpm. Two control schemes that maintain the flatness of the rotating blade are examined in detail. In the first scheme, a pair of concentrated lateral forces are applied to the blade to reduce the blade deflection. In the second scheme, a pair of moments are also applied to the blade to improve the flatness of blade. Simulation results obtained show that the application of control moment is more effective than the simple lateral forces to the improvement of flatness of the slicing blade.
Languages jpn
Resource Type journal article
Publishers 日本機械学会
Date Issued 1994-02
Rights
Copyright: 日本機械学会 (The Japan Society of Mechanical Engineers)()
File Version Version of Record
Access Rights open access
Relations
[ISSN]0387-5024
[NCID]AN00187463
[isVersionOf] [URI]http://www.jsme.or.jp/publish/ronbun/
Schools 大学院理工学研究科(工学)