内周刃ブレードによるシリコンインゴットの切断状態のモニタリングと評価

Monitoring and evaluation of ID blade cutting silicon ingot

Creators Jiang Zhongwei

Creators Chonan Seiji

Creators Kawashima Kazuo

Creators Muto Koji

The silicon ingot must be cut to yield wafers with fiat and smooth surface. However, the flatness and the smoothness are easily affected by the cutting condition of the inner-diameter saw blade. In this paper we present an experimental study on real time monitoring of the ID blade slicer cutting the silicon ingot. The vibration and acoustic signals generated during slicing ingot are measured by a piezoelectric 3-axis sensor fixed onto the supporter of the ingot. The collected data are analyzed by wavelet analysis, and indexes for evaluation of the ID blade slicing state are proposed and discussed in detail. The results show that the condition of the blade could be predicted and monitored by the slicing signals with add of the wavelet analysis.

Copyright: 日本機械学会 (The Japan Society of Mechanical Engineers)()

[ISSN]0387-5024

[NCID]AN00187463

[isVersionOf] [URI]http://www.jsme.or.jp/publish/ronbun/