Active flatness control of a large-scale silicon-wafer slicer cutting a crystal ingot : effect on the deflection control of the air film stiffness between the blade and the ingot

大口径薄刃スライサのアクティブ刃先制御に関する研究 : ブレード・インゴット間の空気膜剛性制御の効果

Active flatness control of a large-scale silicon-wafer slicer cutting a crystal ingot : effect on the deflection control of the air film stiffness between the blade and the ingot

Creators Masui Keijiro

Creators Chonan Seiji

Creators Jiang Zhong-Wei

The response of an ID sawblade slicing a crystal ingot is studied analytically with the effect of the air film stiffness between the ingot and the blade taken into account. The rotating blade is clamped and stressed initially in the radial direction at the outer periphery, while the inner edge is subjected to both the in-plane stationary and the lateral dynamic slicing loads from the workpiece. The solution is obtained by using the Fourier expansion method, and also the Galerkin method on the governing equations of the system. The distributed air film between the blade and the ingot is approximated by a set of parallel translational springs. Numerical results are presented for an actual SUS 301 blade cutting a 6"-diameter silicon ingot at a speed of 1550 rpm. Both the steady-state and the transient response of the blade are obtained. Effects of the spring stiffness and the location on the blade deflection are examined. The results obtained show that the blade deflection is greatly affected by the air film stiffness, and that the flatness of the rotating blade is improved effectively by controlling the air flow rate and increasing the air film stiffness appropriately between the blade and the ingot.

Copyright: 日本機械学会 (The Japan Society of Mechanical Engineers)()

[ISSN]0387-5024

[NCID]AN00187463

[isVersionOf] [URI]http://www.jsme.or.jp/publish/ronbun/