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Jiang Zhongwei

Affiliate Master Yamaguchi University

Monitoring and evaluation of ID blade cutting silicon ingot

Transactions of the Japan Society of Mechanical Engineers. C Volume 65 Issue 638 Page 4025-4031
published_at 1999-10
2010010182.pdf
[fulltext] 470 KB
Title
内周刃ブレードによるシリコンインゴットの切断状態のモニタリングと評価
Monitoring and evaluation of ID blade cutting silicon ingot
Creators Jiang Zhongwei
Creators Chonan Seiji
Creators Kawashima Kazuo
Creators Muto Koji
Creator Keywords
ID blade slicer silicon ingot measurement and evaluation wavelet analysis damage of blade dressing
The silicon ingot must be cut to yield wafers with fiat and smooth surface. However, the flatness and the smoothness are easily affected by the cutting condition of the inner-diameter saw blade. In this paper we present an experimental study on real time monitoring of the ID blade slicer cutting the silicon ingot. The vibration and acoustic signals generated during slicing ingot are measured by a piezoelectric 3-axis sensor fixed onto the supporter of the ingot. The collected data are analyzed by wavelet analysis, and indexes for evaluation of the ID blade slicing state are proposed and discussed in detail. The results show that the condition of the blade could be predicted and monitored by the slicing signals with add of the wavelet analysis.
Languages jpn
Resource Type journal article
Publishers 日本機械学会
Date Issued 1999-10
Rights
Copyright: 日本機械学会 (The Japan Society of Mechanical Engineers)()
File Version Version of Record
Access Rights open access
Relations
[ISSN]0387-5024
[NCID]AN00187463
[isVersionOf] [URI]http://www.jsme.or.jp/publish/ronbun/
Schools 大学院理工学研究科(工学)