Resonant coupling type microstrip line interconnect using a bonding ribbon and dielectric pad

Creators Hotta Masashi

Creators Qian Yongxi

Creators Itoh Tatsuo

Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Furthermore, improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant.

Copyright c [1998] IEEE.. Reprinted from IEEE MTT-S International Microwave Symposium digest, vol. 2, 1998, 797-800. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Yamaguchi University Library's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.()

[ISSN]0149-645X

[NCID]AA11094770

info:doi/10.1109/MWSYM.1998.705110