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A novel resonant coupling type microstrip line interconnect

IEICE transactions on electronics Volume E82-C Issue 1 Page 147-150
published_at 1999-01
2008010023.pdf
[fulltext] 389 KB
Title
A novel resonant coupling type microstrip line interconnect
Creators Hotta Masashi
Creators Qian Yongxi
Creators Itoh Tatsuo
Creator Keywords
resonant coupling microstrip line ribbon bonding dielectric pad FDTD
Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.
Languages eng
Resource Type journal article
Publishers 電子情報通信学会
Date Issued 1999-01
Rights
copyright c2008IEICE, 許諾番号08RB0078()
File Version Version of Record
Access Rights open access
Relations
[ISSN]0916-8524
[NCID]AA10826283
[isPartOf] [URI]http://search.ieice.org/index.html
Schools 大学院理工学研究科(工学)